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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 641-660 of 793
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IPC JIG-101
Abstract: This Guide applies to products that are supplied to manufacturers of electrotechnical products for incorporation (into their products). It covers materials and substances that may be present in the supplied product, including ... -
IPC S-816
Abstract: This document is intended to provide guidelines and assistance in performing and troubleshooting the steps involved in the process of producing printed wiring assemblies incorporating surface mounting attachment of components. ... -
IPC TM-650 2.6.9B
Abstract: This test describes a procedure which may be conducted to determine if a printed wiring board is constructed to withstand the dynamic vibrational stresses that may be encountered during field service. This test method ... -
IPC TM-650 2.6.3.1E
Abstract: This test method is used to determine the moisture and insulation resistances of applied polymer solder mask under two separate prescribed conditions of temperature and humidity. One condition is described as Class T and ... -
IPC TM-650 2.6.4B
Abstract: This test method is used to determine the total mass loss (TML) and collected volatile condensable material (CVCM) of materials when exposed to a heated vacuum environment. Mass loss may be due to outgassing of low molecular ... -
IPC A-630
Abstract: This standard provides the requirements for the manufacture, inspection and test for electronic enclosures.
Purpose This standard has been written to direct the manufacturers and end users of electronic ... -
IPC TM-650 2.4.41
Abstract: This method covers determination of the coefficient of linear thermal expansion of electrical insulting materials by use of a thermomechanical analyzer.
This method is applicable to materials that are solid over the ... -
IPC 4101C
Abstract: This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. -
IPC TM-650 2.4.47
Abstract: This test method specifies a qualitative method for assessment of the tackiness of soft soldering flux residues. The method is applicable to fluxes of types L and M. the method is particularly appropriate for applications ... -
IPC TM-650 2.3.16B
Abstract: This method is designed to determine the resin content of a prepreg without removing the resin from the reinforcement. The basis weight of the fabric must be known. This method is applicable to both organic and inorganic ... -
IPC TM-650 2.4.13.1
Abstract: This test method is designed to determine the thermal integrity of unclad or metallic clad laminates using short-term solder exposure. -
IPC TM-650 2.4.13F
Abstract: This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material. -
IPC 1720A
Abstract: FOREWORD
It is not intended that this Assembly Qualification Profile (AQP) satisfies all the requirements of the customer, however, conscientious maintenance of this document and or registration ... -
IPC TM-650 2.4.33C
Abstract: With this test method, the flexural fatigue life for any given bend radius, the flexural fatigue behavior, and the ductility of the conductor metal in percent deformation after tensile failure can be determined.
Note: ... -
IPC TM-650 2.4.8.1
Abstract: This method is designed to determine the peel strength of metal foil when bonded to thin laminates. Peel strength is determined for specimens as received or after conditioning, such as solder immersion or elevated temperature ... -
IPC 1756
Abstract: This standard establishes the requirements for exchanging manufacturing data between suppliers and their customers for electrical and electronic product. This standard applies to products, components, subproducts and ... -
IPC 3408
Abstract: This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board ... -
IPC IPC/JEDEC-9703
Abstract: This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level.
The three main categories discussed within ... -