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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 661-680 of 793
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IPC TR-583
Abstract: INTRODUCTION
Many printed wiring assembly (PWA) failures that occur in the field can be attributed to manufacturing residue that were not properly removed. It is essential that the cleaning process be ... -
IPC TM-650 2.6.11.1
Abstract: This test method is to determine the resistance of the applied conformal coating to reverting to liquid when exposed to high humidity at a specific temperature and time condition for each class. This test method is to ... -
IPC TM-650 2.4.24C
Abstract: This test is designed to determine the Glass Transition Temperature (Tg) and the Thermal Expansion in the Z-Axis of dielectric materials used in printed boards by the use of thermal mechanical analysis (TMA).
Thermal ... -
IPC TM-650 2.5.26A
Abstract: This method describes the test procedure required to measure the insulation resistance of flexible flat cable. -
IPC TM-650 2.6.13
Abstract: This test method will demonstrate a relative degree to which uncoated printed wiring boards are susceptible to dendritic growth due to the presence of ionic residues and condensed moisture. This test method is particularly ... -
IPC TM-650 2.5.5.5.1
Abstract: Summary: This method is for measurement of relative permittivity (er) and dissipation factor or loss tangent (tan d) of circuit board substrates under stripline conditions. Measurements are made by measuring resonances of ... -
IPC TM-650 2.2.14.3
Abstract: This test method is designed to determine the maximum (average) solder particle size in a solder paste using a fineness of grind gauge. -
IPC TM-650 2.2.13.1A
Abstract: A nondestructive inspection method for determining the quality of plated-through connections in printed wiring boards. 1.2 Theory. Copper will display a resistivity of known value depending upon the geometry of the shell ... -
IPC 2517A
Abstract: This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and ... -
IPC 2152
Abstract: This document is intended as a general guide to understanding the relationship between current, conductor size, and temperature, and can be used more specifically in the design and evaluation of copper conductors in printed ... -
IPC TR-580
Abstract: Introduction and Objectives
Chlorofluorocarbons (CFCs) have been used by the electronics industry for many years. CFC-113 and it's azeotropes/blends have been the solvent of choice because of their ... -
IPC TM-650 2.2.19
Abstract: This is a non-destructive test method for quickly and accurately measuring hole pattern locations. -
IPC TM-650 2.6.3F
Abstract: This test method is to determine the degradation of insulating materials by examination of the visual and electrical insulation resistance properties of printed board specimens after exposure to high humidity and heat ... -
IPC 2531
Abstract: General:
The purpose of this specification is to outline the requirements that an SRFF file must meet. The specification describes the file format, outlines the file sections, and indicates how data ... -
IPC SPVC-LAT1
Abstract: This document prescribes general requirements for determining critical physical and mechanical properties of bulk lead-free solder alloys used to make high quality electronic interconnections. This document describes ... -
IPC TM-650 2.2.16
Abstract: This test method is used to evaluate 1:1 artwork masters for adequacy in meeting end product annular ring requirements for the existence of extra, missing, or mislocated pads, and for the correctness of conductor placement ... -
IPC TM-650 2.2.19.1
Abstract: This method is designed to determine dimensional conformance to specification of production-cut panels of laminate or prepreg for length, width, and perpendicularity.