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IPC TM-650 2.6.13
Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring
Organization:
IPC - Association Connecting Electronics Industries
Year: 1985
Abstract: This test method will demonstrate a relative degree to which uncoated printed wiring boards are susceptible to dendritic growth due to the presence of ionic residues and condensed moisture. This test method is particularly suitable for printed wiring board manufacturing process control.
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IPC TM-650 2.6.13
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:41:53Z | |
| date available | 2017-09-04T15:41:53Z | |
| date copyright | 31321 | |
| date issued | 1985 | |
| identifier other | PHXFCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/44165 | |
| description abstract | This test method will demonstrate a relative degree to which uncoated printed wiring boards are susceptible to dendritic growth due to the presence of ionic residues and condensed moisture. This test method is particularly suitable for printed wiring board manufacturing process control. | |
| language | English | |
| title | IPC TM-650 2.6.13 | num |
| title | Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1985 | |
| contenttype | fulltext |