IPC TM-650 2.6.13

Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:41:53Z
date available	2017-09-04T15:41:53Z
date copyright	31321
date issued	1985
identifier other	PHXFCAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/44165
description abstract	This test method will demonstrate a relative degree to which uncoated printed wiring boards are susceptible to dendritic growth due to the presence of ionic residues and condensed moisture. This test method is particularly suitable for printed wiring board manufacturing process control.
language	English
title	IPC TM-650 2.6.13	num
title	Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring	en
type	standard
page	2
status	Active
tree	IPC - Association Connecting Electronics Industries:;1985
contenttype	fulltext