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IPC TM-650 2.6.3F
Moisture and Insulation Resistance, Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2004
Abstract: This test method is to determine the degradation of insulating materials by examination of the visual and electrical insulation resistance properties of printed board specimens after exposure to high humidity and heat conditions. This method allows testing with (Method A) or without (Method B) Conformal Coating. When not specified, Method A is the default method.
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IPC TM-650 2.6.3F
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:40:43Z | |
| date available | 2017-09-04T15:40:43Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | PEPHFBAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/42914 | |
| description abstract | This test method is to determine the degradation of insulating materials by examination of the visual and electrical insulation resistance properties of printed board specimens after exposure to high humidity and heat conditions. This method allows testing with (Method A) or without (Method B) Conformal Coating. When not specified, Method A is the default method. | |
| language | English | |
| title | IPC TM-650 2.6.3F | num |
| title | Moisture and Insulation Resistance, Printed Boards | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |