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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 681-700 of 793
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IPC TM-650 2.5.10.1
Abstract: The purpose of this test method is to quickly assess the adequacy of a given Anisotropically Conductive Adhesive Film (ACF) construction and bonding process for avoiding short circuits between adjacent traces of a flex ... -
IPC TM-650 2.4.9E
Abstract: This test method defines the procedure for determining the bond strength of metal foils that are 18 microns thick or greater clad flexible dielectric material as nominally defined being measured with a 90° peel. -
IPC SM-817A
Abstract: This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board. ... -
IPC 2501
Abstract: The intent of this standard is to establish the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications. Wherever possible, existing ... -
IPC D-350D
Abstract: This standard specifies record formats used to describe printed board products with detail sufficient for tooling, manufacturing and testing requirements. These formats may be used for transmitting information between a ... -
IPC TM-650 2.4.20
Abstract: This test method is to determine the terminal bond strength, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane. -
IPC A-610E SPANISH
Abstract: Este estándar es una compilación de criterios y requerimientos de aceptabilidad de calidad visual para ensambles electrónicos. Este documento presenta los requerimientos de aceptación para la manufactura ... -
IPC TM-650 2.4.5.1
Abstract: This test method is designed to determine the resistance of the conformal coating to cracking and crazing when the coating is exposed to flexing. -
IPC TM-650 2.6.2.1A
Abstract: This test method is designed for use in determining the amount of water absorbed by plastic laminates when immersed in distilled water for 24 hours. -
IPC A-610E HUNGARIAN
Abstract: This standard is a collection of visual quality acceptability requirements for electronic assemblies. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, ... -
IPC TM-650 2.5.5.9
Abstract: This procedure outlines a test method to determine the permittivity (dielectric constant or E'r) and loss tangent (dissipation factor or Tand) of printed wiring materials at various frequencies (from 1 MHz to 1.5 GHz) using ... -
IPC TM-650 2.2.15
Abstract: This method describes the measuring technique used to measure the physical dimensions of flexible flat cable. -
IPC 9504
Abstract: Non-IC Component Evaluations This document describes manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after ... -
IPC TM-650 2.4.41.2A
Abstract: To describe the strain gage method for determining linear thermal expansion of laminated materials within the temperature range of −55 °C to +130 °C and inorganic substrates (nonlaminated) with a range of ... -
IPC TM-650 2.1.10A
Abstract: This inspection method is designed to visually inspect for dicyandamide, commonly called "dicy," that is not dissolved in the resin of prepreg materials in which it is used as a curing agent, by means of polarized lighting. -
IPC TM-650 2.3.17.1B
Abstract: This test is to measure the flow properties of cast adhesive freefilms or coverfilms used in the manufacture of flexible circuitry. The test also provides a measure of the squeeze out, which might be expected to occur ... -
IPC 2584
Abstract: This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and ...