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IPC SM-817A

General Requirements for Dielectric Surface Mounting Adhesives

Organization:
IPC - Association Connecting Electronics Industries
Year: 2014

Abstract: This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board.
Purpose
This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer, syringe and screening/stenciling. Cure methods include ultra-violet (UV) or visible light, heat or ambient conditions.
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/39502
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    IPC SM-817A

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:37:38Z
date available2017-09-04T15:37:38Z
date copyright2014.12.01
date issued2014
identifier otherOVLQJFAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/39502
description abstractThis document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board.
Purpose
This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer, syringe and screening/stenciling. Cure methods include ultra-violet (UV) or visible light, heat or ambient conditions.
languageEnglish
titleIPC SM-817Anum
titleGeneral Requirements for Dielectric Surface Mounting Adhesivesen
typestandard
page24
statusActive
treeIPC - Association Connecting Electronics Industries:;2014
contenttypefulltext
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