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IPC SM-817A
General Requirements for Dielectric Surface Mounting Adhesives
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:37:38Z | |
| date available | 2017-09-04T15:37:38Z | |
| date copyright | 2014.12.01 | |
| date issued | 2014 | |
| identifier other | OVLQJFAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/39502 | |
| description abstract | This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board. Purpose This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer, syringe and screening/stenciling. Cure methods include ultra-violet (UV) or visible light, heat or ambient conditions. | |
| language | English | |
| title | IPC SM-817A | num |
| title | General Requirements for Dielectric Surface Mounting Adhesives | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2014 | |
| contenttype | fulltext |
