• 0
    • ارسال درخواست
    • حذف همه
    • Industrial Standards
    • Defence Standards
  • درباره ما
  • درخواست موردی
  • فهرست استانداردها
    • Industrial Standards
    • Defence Standards
  • راهنما
  • Login
  • لیست خرید شما 0
    • ارسال درخواست
    • حذف همه
View Item 
  •   YSE
  • Industrial Standards
  • IPC - Association Connecting Electronics Industries
  • View Item
  •   YSE
  • Industrial Standards
  • IPC - Association Connecting Electronics Industries
  • View Item
  • All Fields
  • Title(or Doc Num)
  • Organization
  • Year
  • Subject
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Archive

IPC TM-650 2.4.41.2A

Coefficient of Thermal Expansion-Strain Gage Method

Organization:
IPC - Association Connecting Electronics Industries
Year: 2004

Abstract: To describe the strain gage method for determining linear thermal expansion of laminated materials within the temperature range of −55 °C to +130 °C and inorganic substrates (nonlaminated) with a range of −55 °C to +150 °C.
Care should be taken if the higher temperatures are used. The adhesive shown is rated by the manufacturer from less than −200 °C to greater than +300 °C; however, for higher temperature pretesting with the Titanium Silicate Standard or materials of known thermal expansion characteristics is recommended.
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/32575
Collections :
  • IPC - Association Connecting Electronics Industries
  • Download PDF : (36.76Kb)
  • Show Full MetaData Hide Full MetaData
  • Statistics

    IPC TM-650 2.4.41.2A

Show full item record

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:31:05Z
date available2017-09-04T15:31:05Z
date copyright05/01/2004
date issued2004
identifier otherOCPHFBAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/32575
description abstractTo describe the strain gage method for determining linear thermal expansion of laminated materials within the temperature range of −55 °C to +130 °C and inorganic substrates (nonlaminated) with a range of −55 °C to +150 °C.
Care should be taken if the higher temperatures are used. The adhesive shown is rated by the manufacturer from less than −200 °C to greater than +300 °C; however, for higher temperature pretesting with the Titanium Silicate Standard or materials of known thermal expansion characteristics is recommended.
languageEnglish
titleIPC TM-650 2.4.41.2Anum
titleCoefficient of Thermal Expansion-Strain Gage Methoden
typestandard
page4
statusActive
treeIPC - Association Connecting Electronics Industries:;2004
contenttypefulltext
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian
 
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian