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IPC TM-650 2.4.41.2A
Coefficient of Thermal Expansion-Strain Gage Method
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:31:05Z | |
| date available | 2017-09-04T15:31:05Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | OCPHFBAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/32575 | |
| description abstract | To describe the strain gage method for determining linear thermal expansion of laminated materials within the temperature range of −55 °C to +130 °C and inorganic substrates (nonlaminated) with a range of −55 °C to +150 °C. Care should be taken if the higher temperatures are used. The adhesive shown is rated by the manufacturer from less than −200 °C to greater than +300 °C; however, for higher temperature pretesting with the Titanium Silicate Standard or materials of known thermal expansion characteristics is recommended. | |
| language | English | |
| title | IPC TM-650 2.4.41.2A | num |
| title | Coefficient of Thermal Expansion-Strain Gage Method | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |
