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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 701-720 of 793
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IPC TM-650 2.2.18
Abstract: This test method is designed to determine the thickness of unclad or metallic clad laminate, with or without the cladding, using mechanical measurements. -
IPC TM-650 2.4.21F
Abstract: This test method is to determine the land bond strength of unsupported holes, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane. -
IPC TM-650 2.3.25.1
Abstract: This test is used to determine the total ionic content extractable from on, and absorbed within, the surface of printed wiring boards (PWBs), for the purposes of process control. The conductivity of the extract solution ... -
IPC 4921
Abstract: Statement of Scope This standard establishes the classification system, the qualification and quality conformance requirements for printed electronics base materials (substrates).
The standard defines ... -
IPC TM-650 2.4.9.2
Abstract: In order to assess the actual performance of any given lot of material, it is necessary to apply and thermally bond the material between the substrates of interest. This method describes the recommended procedure for both ... -
IPC TM-650 2.4.37.2
Abstract: This test method is to be used for the evaluation of hand soldering tools under a simulated heavy load such as that presented by PWBs with abnormally thick ground or power planes. Separate test methods (IPC-TM-650, Methods ... -
IPC TM-650 2.6.14.1
Abstract: This test method provides a means to assess the propensity for surface electrochemical migration. This test method can be used to assess soldering materials and/or processes. -
IPC AJ-820A
Abstract: This document provides guidelines and supporting information for manufacturing electronic assemblies. The intent is to explain the ‘‘how-to'' and ‘‘why'' information, and fundamentals for these ... -
IPC 8497-1
Abstract: The scope of this specification is to describe the methods of inspecting and cleaning all optical interfaces so that their interconnectivity does not result in loss of optical signal. It also describes methods of contamination ... -
IPC 3406
Abstract: This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives ... -
IPC TM-650 2.6.16.1
Abstract: This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated constructions, the results ... -
IPC 9194
Abstract: The IPC-9194 should be used in conjunction with IPC- 9191. The IPC-9191 provides general guidelines for implementing SPC in electronics industry.
This standard is intended to aid in interpretation of the requirements ... -
IPC TM-650 2.4.11
Abstract: This method covers the punch-type shear test to determine the shear strength of flexible dielectric substrate materials. -
IPC 8413-1
Abstract: The purpose of the specification is to define standard practices for handling various kinds of optical fiber and to define the specifications and guidelines to be used in the design of carriers for these fibers in component ... -
IPC 2547
Abstract: This document describes event message content and an XML encoding scheme, that enables a detailed definition of messages in the domain of electronics inspection, test and repair/rework (i.e. product and process quality). ... -
IPC TM-650 2.4.5
Abstract: This method is used to determine the mechanical and electrical behavior of flexible printed wiring materials after exposure to two cycles of folding. -
IPC TM-650 2.3.4B
Abstract: This test method is used for determining that marking inks and/or color coding will not become illegible or discolored when subjected to solutions that are normally used as cleaning agents for printed boards or printed ... -
IPC J-STD-003B CHINESE
Abstract: This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This standard is intended for use ...