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IPC J-STD-003B CHINESE
English -- Solderability Tests for Printed Boards;
Chinese -- 印制板可焊性测试
Organization:
IPC - Association Connecting Electronics Industries
Year: 2007
Abstract: This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This standard is intended for use by both vendor and user.
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IPC J-STD-003B CHINESE
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:25:51Z | |
| date available | 2017-09-04T15:25:51Z | |
| date copyright | 03/01/2007 | |
| date issued | 2007 | |
| identifier other | AUXFLCAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/26480 | |
| description abstract | This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This standard is intended for use by both vendor and user. | |
| language | Chinese | |
| title | IPC J-STD-003B CHINESE | num |
| title | English -- Solderability Tests for Printed Boards | en |
| title | Chinese -- 印制板可焊性测试 | other |
| type | standard | |
| page | 52 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |