IPC J-STD-003B CHINESE

English -- Solderability Tests for Printed Boards;
Chinese -- 印制板可焊性测试

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:25:51Z
date available	2017-09-04T15:25:51Z
date copyright	03/01/2007
date issued	2007
identifier other	AUXFLCAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/26480
description abstract	This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This standard is intended for use by both vendor and user.
language	Chinese
title	IPC J-STD-003B CHINESE	num
title	English -- Solderability Tests for Printed Boards	en
title	Chinese -- 印制板可焊性测试	other
type	standard
page	52
status	Active
tree	IPC - Association Connecting Electronics Industries:;2007
contenttype	fulltext