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IPC TM-650 2.6.14.1
Electrochemical Migration Resistance Test
Organization:
IPC - Association Connecting Electronics Industries
Year: 2000
Abstract: This test method provides a means to assess the propensity for surface electrochemical migration. This test method can be used to assess soldering materials and/or processes.
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IPC TM-650 2.6.14.1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:28:55Z | |
| date available | 2017-09-04T15:28:55Z | |
| date copyright | 09/01/2000 | |
| date issued | 2000 | |
| identifier other | AWAVNAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/30135 | |
| description abstract | This test method provides a means to assess the propensity for surface electrochemical migration. This test method can be used to assess soldering materials and/or processes. | |
| language | English | |
| title | IPC TM-650 2.6.14.1 | num |
| title | Electrochemical Migration Resistance Test | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2000 | |
| contenttype | fulltext |