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Electrochemical Migration Resistance Test

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:28:55Z
date available2017-09-04T15:28:55Z
date copyright09/01/2000
date issued2000
identifier otherAWAVNAAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/30135
description abstractThis test method provides a means to assess the propensity for surface electrochemical migration. This test method can be used to assess soldering materials and/or processes.
languageEnglish
titleIPC TM-650 2.6.14.1num
titleElectrochemical Migration Resistance Testen
typestandard
page3
statusActive
treeIPC - Association Connecting Electronics Industries:;2000
contenttypefulltext


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