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IPC 3406
Guidelines for Electrically Conductive Surface Mount Adhesives
Organization:
IPC - Association Connecting Electronics Industries
Year: 1996
Abstract: This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure as much as possible. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (uni-directional conductivity), are covered. The two major divi- sions of polymer adhesives, thermosets and thermoplastics, are described.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:28:00Z | |
| date available | 2017-09-04T15:28:00Z | |
| date copyright | 07/01/1996 | |
| date issued | 1996 | |
| identifier other | NTBRCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/28998 | |
| description abstract | This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure as much as possible. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (uni-directional conductivity), are covered. The two major divi- sions of polymer adhesives, thermosets and thermoplastics, are described. | |
| language | English | |
| title | IPC 3406 | num |
| title | Guidelines for Electrically Conductive Surface Mount Adhesives | en |
| type | standard | |
| page | 23 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1996 | |
| contenttype | fulltext |