IPC 3406

Guidelines for Electrically Conductive Surface Mount Adhesives

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:28:00Z
date available	2017-09-04T15:28:00Z
date copyright	07/01/1996
date issued	1996
identifier other	NTBRCAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/28998
description abstract	This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure as much as possible. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (uni-directional conductivity), are covered. The two major divi- sions of polymer adhesives, thermosets and thermoplastics, are described.
language	English
title	IPC 3406	num
title	Guidelines for Electrically Conductive Surface Mount Adhesives	en
type	standard
page	23
status	Active
tree	IPC - Association Connecting Electronics Industries:;1996
contenttype	fulltext