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IPC TM-650 2.4.21F
Land Bond Strength, Unsupported Component Hole
Organization:
IPC - Association Connecting Electronics Industries
Year: 2007
Abstract: This test method is to determine the land bond strength of unsupported holes, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane.
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IPC TM-650 2.4.21F
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:29:58Z | |
| date available | 2017-09-04T15:29:58Z | |
| date copyright | 01/01/2007 | |
| date issued | 2007 | |
| identifier other | NZGVACAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/31321 | |
| description abstract | This test method is to determine the land bond strength of unsupported holes, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane. | |
| language | English | |
| title | IPC TM-650 2.4.21F | num |
| title | Land Bond Strength, Unsupported Component Hole | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |