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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 721-740 of 793
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IPC D-859
Abstract: This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. -
IPC TM-650 2.5.30
Abstract: This method is used to determine the attenuation of balanced and unbalanced cables. -
IPC 1751A
Abstract: This standard provides the principles and details necessary for declarations between members of a supply chain. Although this 1751A standard contains only generic information regarding trading partners, when combined with ... -
IPC TM-650 2.5.4.1A
Abstract: This method is to comparatively determine the effects of printed conductor materials, conductor cross sectional measurements, substrate materials, and processes on the temperature D.C. current characteristics of printed ... -
IPC TM-650 2.5.27
Abstract: This test method is designed to determine the surface insulation resistance of dielectric material after the prescribed conditioning cycles. -
IPC TM-650 2.4.34
Abstract: The test specifies a standard procedure for determining the viscosity of solder paste in the range of 300,000 to 1,600,000 centipoise. -
IPC TM-650 2.6.1G
Abstract: The fungus resistance test is used to determine the resistance of materials to fungi and to determine if such material is adversely affected by fungi under conditions favorable for their development, namely high humidity, ... -
IPC TM-650 2.3.11
Abstract: The purpose of this test method is to provide a procedure for examining glass fabric to determine its construction, including its weight, thickness, strength, and type of weave. Since this method may be used to examine ... -
IPC 7351B
Abstract: This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance ... -
IPC 8701
Abstract: SCOPE AND CLASSIFICATION
This IPC standard presents acceptance guidelines for the solar panel in final module assembly. The intent of this standard is to cover crystalline solar modules. The modules ... -
IPC TM-650 2.5.5.4
Abstract: The purpose of this test method is to provide a usable test procedure to determine the dielectric constant and dissipation factor of printed wiring materials at various frequencies (from 22kHz to 70mHz). -
IPC TM-650 2.4.1E
Abstract: This test method uses pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with Printed Boards. -
IPC TM-650 2.1.5A
Abstract: This test method identifies the major areas of concern during a visual examination and describes the recommended procedures. -
IPC TM-650 2.1.1.1
Abstract: This procedure describes the preparation of metallographic specimens containing ceramic components mounted on printed wiring boards or ceramic substrates. This procedure must be carefully followed to minimize ceramic ...