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IPC TM-650 2.4.1E
Adhesion, Tape Testing
Organization:
IPC - Association Connecting Electronics Industries
Year: 2004
Abstract: This test method uses pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with Printed Boards.
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IPC TM-650 2.4.1E
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:21:33Z | |
| date available | 2017-09-04T15:21:33Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | MZOHFBAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/21539 | |
| description abstract | This test method uses pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with Printed Boards. | |
| language | English | |
| title | IPC TM-650 2.4.1E | num |
| title | Adhesion, Tape Testing | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |