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Adhesion, Tape Testing

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:21:33Z
date available2017-09-04T15:21:33Z
date copyright05/01/2004
date issued2004
identifier otherMZOHFBAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/21539
description abstractThis test method uses pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with Printed Boards.
languageEnglish
titleIPC TM-650 2.4.1Enum
titleAdhesion, Tape Testingen
typestandard
page1
statusActive
treeIPC - Association Connecting Electronics Industries:;2004
contenttypefulltext


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