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IPC TM-650 2.5.4.1A

Conductor Temperature Rise Due to Current Changes in Conductors

Organization:
IPC - Association Connecting Electronics Industries
Year: 1997

Abstract: This method is to comparatively determine the effects of printed conductor materials, conductor cross sectional measurements, substrate materials, and processes on the temperature D.C. current characteristics of printed wiring boards on a standard test sample. The temperature rise must be given for each conductor materials for a particular value of current, for a specified conductor cross sectional area, approximate geometry and substrate material. The results are reported as a plot of temperature rises versus current for each of the conductor materials, cross sectional areas, approximate geometry, and a substrate material.
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/25392
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    IPC TM-650 2.5.4.1A

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:24:53Z
date available2017-09-04T15:24:53Z
date copyright08/01/1997
date issued1997
identifier otherNJSXCAAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/25392
description abstractThis method is to comparatively determine the effects of printed conductor materials, conductor cross sectional measurements, substrate materials, and processes on the temperature D.C. current characteristics of printed wiring boards on a standard test sample. The temperature rise must be given for each conductor materials for a particular value of current, for a specified conductor cross sectional area, approximate geometry and substrate material. The results are reported as a plot of temperature rises versus current for each of the conductor materials, cross sectional areas, approximate geometry, and a substrate material.
languageEnglish
titleIPC TM-650 2.5.4.1Anum
titleConductor Temperature Rise Due to Current Changes in Conductorsen
typestandard
page3
statusActive
treeIPC - Association Connecting Electronics Industries:;1997
contenttypefulltext
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