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IPC TM-650 2.5.4.1A
Conductor Temperature Rise Due to Current Changes in Conductors
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:24:53Z | |
| date available | 2017-09-04T15:24:53Z | |
| date copyright | 08/01/1997 | |
| date issued | 1997 | |
| identifier other | NJSXCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/25392 | |
| description abstract | This method is to comparatively determine the effects of printed conductor materials, conductor cross sectional measurements, substrate materials, and processes on the temperature D.C. current characteristics of printed wiring boards on a standard test sample. The temperature rise must be given for each conductor materials for a particular value of current, for a specified conductor cross sectional area, approximate geometry and substrate material. The results are reported as a plot of temperature rises versus current for each of the conductor materials, cross sectional areas, approximate geometry, and a substrate material. | |
| language | English | |
| title | IPC TM-650 2.5.4.1A | num |
| title | Conductor Temperature Rise Due to Current Changes in Conductors | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1997 | |
| contenttype | fulltext |
