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IPC TM-650 2.6.1G
Fungus Resistance of Printed Board Materials
Organization:
IPC - Association Connecting Electronics Industries
Year: 2007
Abstract: The fungus resistance test is used to determine the resistance of materials to fungi and to determine if such material is adversely affected by fungi under conditions favorable for their development, namely high humidity, warm atmosphere, and presence of inorganic salts.
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IPC TM-650 2.6.1G
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:23:29Z | |
| date available | 2017-09-04T15:23:29Z | |
| date copyright | 03/01/2007 | |
| date issued | 2007 | |
| identifier other | NFHVACAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/23722 | |
| description abstract | The fungus resistance test is used to determine the resistance of materials to fungi and to determine if such material is adversely affected by fungi under conditions favorable for their development, namely high humidity, warm atmosphere, and presence of inorganic salts. | |
| language | English | |
| title | IPC TM-650 2.6.1G | num |
| title | Fungus Resistance of Printed Board Materials | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |