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IPC TM-650 2.1.13B
Inspection for Voids in Flexible Printed Board Materials
Organization:
IPC - Association Connecting Electronics Industries
Year: 2012
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IPC TM-650 2.1.13B
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:23:50Z | |
| date available | 2017-09-04T15:23:50Z | |
| date copyright | 05/01/2012 | |
| date issued | 2012 | |
| identifier other | NGLMGFAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/24154 | |
| language | English | |
| title | IPC TM-650 2.1.13B | num |
| title | Inspection for Voids in Flexible Printed Board Materials | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2012 | |
| contenttype | fulltext |