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IPC D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
Organization:
IPC - Association Connecting Electronics Industries
Year: 1989
Abstract: This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:25:14Z | |
| date available | 2017-09-04T15:25:14Z | |
| date copyright | 32843 | |
| date issued | 1989 | |
| identifier other | NKSZCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/25773 | |
| description abstract | This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. | |
| language | English | |
| title | IPC D-859 | num |
| title | Design Standard for Thick Film Multilayer Hybrid Circuits | en |
| type | standard | |
| page | 88 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1989 | |
| contenttype | fulltext |