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IPC TM-650 2.1.1.1
Microsectioning, Ceramic Substrate
Organization:
IPC - Association Connecting Electronics Industries
Year: 1987
Abstract: This procedure describes the preparation of metallographic specimens containing ceramic components mounted on printed wiring boards or ceramic substrates. This procedure must be carefully followed to minimize ceramic chunking and to maintain a flat surface.
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IPC TM-650 2.1.1.1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:20:53Z | |
| date available | 2017-09-04T15:20:53Z | |
| date copyright | 32112 | |
| date issued | 1987 | |
| identifier other | MXRLCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/20869 | |
| description abstract | This procedure describes the preparation of metallographic specimens containing ceramic components mounted on printed wiring boards or ceramic substrates. This procedure must be carefully followed to minimize ceramic chunking and to maintain a flat surface. | |
| language | English | |
| title | IPC TM-650 2.1.1.1 | num |
| title | Microsectioning, Ceramic Substrate | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |