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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 741-760 of 793
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IPC 1752A
Abstract: This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for electrical and electronic product. This standard applies to products, components, subproducts ... -
IPC TM-650 2.2.12.1
Abstract: This method provides a technique for determining the overall thickness of treated or untreated copper foils and for determining the profile factor on foils used for the manufacture of electrical grade laminates and multilayer ... -
IPC 7092
Abstract: This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. The completed structure including internal electronic ... -
IPC TM-650 2.5.5.7A
Abstract: This document describes time domain reflectometry (TDR) methods for measuring and calculating the characteristic impedance, Z(0), of a transmission line on a printed circuit board (PCB). In TDR, a signal, usually a step ... -
IPC HDBK-005
Abstract: This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This ... -
IPC TM-650 2.4.30
Abstract: This test method is to determine the impact resistance of polymer film circuitry when exposed to a series of falling ball impingements. The method is used to evaluate the resistance to chipping, flaking, convolution or ... -
IPC TM-650 2.5.1B
Abstract: This method describes a technique for evaluating the ability of a material to resist tracking when subjected to a high voltage low current arc just above the surface of the material. It can be used on materials of various ... -
IPC A-600H
Abstract: This document describes the preferred, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards. It represents the visual interpretation of minimum requirements set ... -
IPC TM-650 1.8 GUIDE
Abstract: Introduction
Welcome to the Measurement Precision Calculator. This utility will help perform the calculations for Measurement Systems Analysis (MSA) described in the IPC Test Method IPC-TM-1.8.
This ... -
IPC TM-650 2.3.23.1A
Abstract: This test method covers the cure, or permanence testing of ultraviolet-initiated dry film solder mask (solder resist) organic coatings. Dry film solder masking is the application of a film coating on laminates and circuits. ... -
IPC A-142
Abstract: This specification covers finished fabrics woven from aramid yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain ... -
IPC 4101C GERMAN
Abstract: Diese Spezifikation beinhaltet die Anforderungen an Basismaterialien, hier als Laminate oder Prepregs bezeichnet, die hauptsächlich in starren Leiterplatten oder Multilayerleiterplatten für elektrische und ... -
IPC TM-650 2.5.24
Abstract: This method describes the test procedure required to measure the conductor resistance of flexible flat cable. -
IPC SM-840E
Abstract: This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test ... -
IPC 9592B
Abstract: This document standardizes the requirements for power conversion devices (PCDs) for the computer and telecommunications industries. The phrase ‘‘power conversion devices'' refers to ac to dc and dc to dc modules, ...