IPC SM-840E

Abstract

This specification <strong>shall</strong> define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test redundancy. <br>This specification <strong>shall</strong> establish the requirements for: <br>&#8226; The evaluation of solder mask materials. <br>&#8226; The conformance of solder mask material properties. <br>&#8226; The qualification of the solder mask via the appropriate test substrate. <br>&#8226; The qualification assessment of the solder mask in conjunction with the production printed board process. <br><strong>Purpose</strong> This specification <strong>shall</strong> establish the requirements, based on applicable test methods and conditions, for the evaluation of a solder mask and cover material and for the determination of the acceptability of use on a printed board. These same requirements shall also be used to qualify a printed board production process based on conformance criteria defined by the reliability requirements of the end use environment. Acceptability and/or verification criteria of the production printed board <strong>shall</strong> be determined in accordance with the applicable performance requirements (e.g., IPC-6012, IPC-6013, IPC-6018, etc.). <br>The solder mask materials described herein, when applied to the printed board substrate are intended to prevent and/or minimize the formation and adherence of solder balls, solder bridging, solder build-up and physical damage to the printed board substrate. The solder mask material <strong>shall</strong> retard electromigration and other forms of detrimental or conductive growth. <br>The cover materials described herein, when applied to the printed board substrate, shall provide a flexible dielectric protective layer over the etched conductors and other conductive features. The cover materials are intended to prevent and/or minimize the formation and adherence of solder balls, solder bridging, solder build-up and physical damage to the printed board substrate. The cover materials <strong>shall</strong> retard electromigration and other forms of detrimental or conductive growth. <br><strong>NOTE:</strong> The determination of compatibility between solder mask and cover materials and post soldering products and processes is beyond the scope of this specification. The use of Test Methods specified herein to determine the compatibility and the requirement to do so shall be as agreed between user and supplier (AABUS). <br>This specification <strong>shall</strong> list the base requirements for solder mask and cover materials and their production processes. The solder mask and cover material <strong>shall</strong> be cured per the manufacturer's recommended process in accordance with those conditions specified for that product. Additional requirements or deviations from these requirements <strong>shall</strong> be AABUS.