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IPC 7092
Design and Assembly Process Implementation for Embedded Components
Organization:
IPC - Association Connecting Electronics Industries
Year: 2015
Abstract: This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and can be made from organic, inorganic (ceramic) or both types of material.
Purpose The target audiences for this document are managers, design and process engineers, and technicians who develop electronic assemblies that include an embedded component printed board as a part of the product. The purpose is to provide useful and practical information to those who are involved in the decision making of either formed or placed, passive or active components and to help establish inspection techniques, testing processes, and reliability validations.
Purpose The target audiences for this document are managers, design and process engineers, and technicians who develop electronic assemblies that include an embedded component printed board as a part of the product. The purpose is to provide useful and practical information to those who are involved in the decision making of either formed or placed, passive or active components and to help establish inspection techniques, testing processes, and reliability validations.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:19:50Z | |
| date available | 2017-09-04T15:19:50Z | |
| date copyright | 2015.02.01 | |
| date issued | 2015 | |
| identifier other | MUNXJFAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/19710 | |
| description abstract | This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and can be made from organic, inorganic (ceramic) or both types of material. Purpose The target audiences for this document are managers, design and process engineers, and technicians who develop electronic assemblies that include an embedded component printed board as a part of the product. The purpose is to provide useful and practical information to those who are involved in the decision making of either formed or placed, passive or active components and to help establish inspection techniques, testing processes, and reliability validations. | |
| language | English | |
| title | IPC 7092 | num |
| title | Design and Assembly Process Implementation for Embedded Components | en |
| type | standard | |
| page | 148 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2015 | |
| contenttype | fulltext |