IPC 7092

Abstract

This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and can be made from organic, inorganic (ceramic) or both types of material. <br><strong>Purpose</strong> The target audiences for this document are managers, design and process engineers, and technicians who develop electronic assemblies that include an embedded component printed board as a part of the product. The purpose is to provide useful and practical information to those who are involved in the decision making of either formed or placed, passive or active components and to help establish inspection techniques, testing processes, and reliability validations.