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IPC TM-650 2.5.1B
Arc Resistance of Printed Wiring Material
Organization:
IPC - Association Connecting Electronics Industries
Year: 1986
Abstract: This method describes a technique for evaluating the ability of a material to resist tracking when subjected to a high voltage low current arc just above the surface of the material. It can be used on materials of various thickness by stacking materials. This procedure is based on techniques described in ASTM D495.
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IPC TM-650 2.5.1B
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:18:07Z | |
| date available | 2017-09-04T15:18:07Z | |
| date copyright | 05/01/1986 | |
| date issued | 1986 | |
| identifier other | ASIZCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/17702 | |
| description abstract | This method describes a technique for evaluating the ability of a material to resist tracking when subjected to a high voltage low current arc just above the surface of the material. It can be used on materials of various thickness by stacking materials. This procedure is based on techniques described in ASTM D495. | |
| language | English | |
| title | IPC TM-650 2.5.1B | num |
| title | Arc Resistance of Printed Wiring Material | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1986 | |
| contenttype | fulltext |