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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 761-780 of 793
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IPC 1601 GERMAN
Abstract: This document provides suggestions for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. These guidelines are intended to protect printed boards from contamination, ... -
IPC HM-860
Abstract: This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by ... -
IPC TM-650 2.6.26A
Abstract: These methods determine the physical endurance of representative coupons of printed boards to a series of high temperature excursions from ambient. The temperature excursions cause thermo-mechanical fatigue of the electrical ... -
IPC TM-650 2.2.4C
Abstract: This test method is used to establish and define the procedures for determining thermal gradient dimensional changes of a plastic dielectric, metal clad or unclad. This method may also be used to determine dimensional ... -
IPC 4554
Abstract: This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer (CM) and original equipment ... -
IPC 7711B/7721B
Abstract: This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance ... -
IPC IPC/WHMA-A-620B-S
Abstract: This addendum provides additional requirements over those published in IPC/WHMA-A-620B to ensure the performance of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting ... -
IPC 0040
Abstract: This document addresses the implementation of optical and optoelectronic packaging technologies.
The areas discussed include: technology choices, design considerations, material properties, component mounting and ... -
IPC 2251
Abstract: The goal in electronic packaging is to transfer a signal from one device to one or more other devices through a conductor. Considerations include electrical noise, electromagnetic interference, signal propagation time, ... -
IPC CM-770E
Abstract: Chip-On-Flex (COF) – Surface mounted chip attached directly onto flexible printed boards. Chip-On-Glass (COG) – An assembly technology that uses an unpackaged semiconductor die mounted directly on a glass ... -
IPC TR-466
Abstract: INTRODUCTION
The wetting balance test method was the subject of much discussion during the preparation of ANSI/J-STD-O02, Solderability Tests for Components Leads, Terminations, Lugs, Terminals and ... -
IPC TM-650 2.4.41.3
Abstract: Scope This test method establishes a procedure for determining the in-plane coefficient of linear thermal expansion of organic films from 0-200°C using thermal mechanical analysis (TMA). -
IPC TM-650 2.6.23
Abstract: This test procedure measures the temperature repeatability inside steam agers used to condition components prior to solderability testing. It should be applied at installation and after any modification to the equipment ...