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IPC 7711B/7721B

REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES

Organization:
IPC - Association Connecting Electronics Industries
Year: 2007

Abstract: This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of the IPC. This revision includes expanded coverage for lead free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria. This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly.
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/8542
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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:10:16Z
date available2017-09-04T15:10:16Z
date copyright39387
date issued2007
identifier otherLQUFCCAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/8542
description abstractThis document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of the IPC. This revision includes expanded coverage for lead free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria. This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly.
languageEnglish
titleIPC 7711B/7721Bnum
titleREWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIESen
typestandard
page360
statusActive
treeIPC - Association Connecting Electronics Industries:;2007
contenttypefulltext
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