IPC 7711B/7721B

REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:10:16Z
date available	2017-09-04T15:10:16Z
date copyright	39387
date issued	2007
identifier other	LQUFCCAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/8542
description abstract	This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of the IPC. This revision includes expanded coverage for lead free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria. This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly.
language	English
title	IPC 7711B/7721B	num
title	REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES	en
type	standard
page	360
status	Active
tree	IPC - Association Connecting Electronics Industries:;2007
contenttype	fulltext