درباره ما
IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 781-793 of 793
-
IPC WP-009
Abstract: ABSTRACT
As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to the emergence of pure tin as a dominate component surface ... -
IPC TM-650 2.5.3B
Abstract: To determine if the plated through-holes are sufficiently plated to withstand a relatively high current potential. -
IPC 2516A
Abstract: This standard specifies data formats used to describe printed circuit board assembly product manufacturing methodologies. These formats may be used for transmitting information between a printed circuit board designers, ... -
IPC TM-650 2.6.8E
Abstract: This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly, rework, or repair process. -
IPC TM-650 2.4.43
Abstract: This test is carried out to determine the reflow properties of the solder paste. The ability of the prealloyed solder particles in the paste to reflow into a sphere on a nonwettable substrate is determined under defined ... -
IPC 6012C GERMAN
Abstract: Diese Spezifikation deckt die Qualifikation und Leistungs-spezifikation für starre Leiterplatten ab. Die Leiterplatte kann einseitig oder zweiseitig, mit oder ohne durchkontaktierten Löchern ausgeführt sein. ... -
IPC 2583
Abstract: This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and ... -
IPC IPC/JEDEC J-STD-020E
Abstract: This classification procedure applies to all nonhermetic SMDs in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic ... -
IPC TM-650
Abstract: Introduction
This manual establishes uniform methods for testing electronic and electrical parts including basic environmental, physical and electrical tests. These tests were developed to support IPC ... -
IPC TM-650 2.4.17
Abstract: This method is to determine the average force in grams required to propagate tearing through a specific length of the constant radius specimen. Because of the variation of materials and orientation of fibers, the method ... -
IPC TM-650 2.3.35.1A
Abstract: This test method is designed to determine the presence (if any) of fluoride(s) in soldering flux by visual examination after placement of a drop of liquid test flux in a zirconium - alizarin purple lake. -
IPC 4203A
Abstract: This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides which are to be used as cover material for ...