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IPC TM-650 2.4.43
Solder Paste - Solder Ball Test
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This test is carried out to determine the reflow properties of the solder paste. The ability of the prealloyed solder particles in the paste to reflow into a sphere on a nonwettable substrate is determined under defined test conditions.
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IPC TM-650 2.4.43
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:05:10Z | |
| date available | 2017-09-04T15:05:10Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | LBGECAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/2609 | |
| description abstract | This test is carried out to determine the reflow properties of the solder paste. The ability of the prealloyed solder particles in the paste to reflow into a sphere on a nonwettable substrate is determined under defined test conditions. | |
| language | English | |
| title | IPC TM-650 2.4.43 | num |
| title | Solder Paste - Solder Ball Test | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |