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IPC 4203A
Cover and Bonding Material for Flexible Printed Circuitry
Organization:
IPC - Association Connecting Electronics Industries
Year: 2013
Abstract: This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides which are to be used as cover material for flexible printed circuitry as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. It does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions which are covered in IPC- 4101. Materials such as liquid-applied covercoat (see 3.1.8.3) are covered in IPC-SM-840 and are excluded from this document.
This specification supersedes both IPC-FC-232C and IPC-FC-233A and the requirements herein meet or exceed the requirements for Class 3 in these superseded documents. Note that conformance to Class 3 meets or exceeds conformance to Classes 1 and 2. IPC-4203 no longer utilizes the 3-class system.
This specification supersedes both IPC-FC-232C and IPC-FC-233A and the requirements herein meet or exceed the requirements for Class 3 in these superseded documents. Note that conformance to Class 3 meets or exceeds conformance to Classes 1 and 2. IPC-4203 no longer utilizes the 3-class system.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:03:36Z | |
| date available | 2017-09-04T15:03:36Z | |
| date copyright | 01/01/2013 | |
| date issued | 2013 | |
| identifier other | KWJQBFAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/788 | |
| description abstract | This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides which are to be used as cover material for flexible printed circuitry as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. It does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions which are covered in IPC- 4101. Materials such as liquid-applied covercoat (see 3.1.8.3) are covered in IPC-SM-840 and are excluded from this document. This specification supersedes both IPC-FC-232C and IPC-FC-233A and the requirements herein meet or exceed the requirements for Class 3 in these superseded documents. Note that conformance to Class 3 meets or exceeds conformance to Classes 1 and 2. IPC-4203 no longer utilizes the 3-class system. | |
| language | English | |
| title | IPC 4203A | num |
| title | Cover and Bonding Material for Flexible Printed Circuitry | en |
| type | standard | |
| page | 52 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2013 | |
| contenttype | fulltext |