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IPC TM-650 2.6.8E
Thermal Stress, Plated-Through Holes
Organization:
IPC - Association Connecting Electronics Industries
Year: 2004
Abstract: This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly, rework, or repair process.
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IPC TM-650 2.6.8E
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:06:44Z | |
| date available | 2017-09-04T15:06:44Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | LFPHFBAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/4273 | |
| description abstract | This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly, rework, or repair process. | |
| language | English | |
| title | IPC TM-650 2.6.8E | num |
| title | Thermal Stress, Plated-Through Holes | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |