IPC TM-650 2.6.8E

Thermal Stress, Plated-Through Holes

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:06:44Z
date available	2017-09-04T15:06:44Z
date copyright	05/01/2004
date issued	2004
identifier other	LFPHFBAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/4273
description abstract	This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly, rework, or repair process.
language	English
title	IPC TM-650 2.6.8E	num
title	Thermal Stress, Plated-Through Holes	en
type	standard
page	2
status	Active
tree	IPC - Association Connecting Electronics Industries:;2004
contenttype	fulltext