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IPC HM-860
Specification for Multilayer Hybrid Circuits
Organization:
IPC - Association Connecting Electronics Industries
Year: 1987
Abstract: This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate structure may- include passive elements.
Purpose. The purpose of this specification is to provide qualification and acceptance requirements for commercial and government procurement of multilayer circuits used in hybrid packaging
Purpose. The purpose of this specification is to provide qualification and acceptance requirements for commercial and government procurement of multilayer circuits used in hybrid packaging
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:13:33Z | |
| date available | 2017-09-04T15:13:33Z | |
| date copyright | 01/01/1987 | |
| date issued | 1987 | |
| identifier other | MASDCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/12285 | |
| description abstract | This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate structure may- include passive elements. Purpose. The purpose of this specification is to provide qualification and acceptance requirements for commercial and government procurement of multilayer circuits used in hybrid packaging | |
| language | English | |
| title | IPC HM-860 | num |
| title | Specification for Multilayer Hybrid Circuits | en |
| type | standard | |
| page | 35 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |