IPC HM-860

Specification for Multilayer Hybrid Circuits

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:13:33Z
date available	2017-09-04T15:13:33Z
date copyright	01/01/1987
date issued	1987
identifier other	MASDCAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/12285
description abstract	This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate structure may- include passive elements. Purpose. The purpose of this specification is to provide qualification and acceptance requirements for commercial and government procurement of multilayer circuits used in hybrid packaging
language	English
title	IPC HM-860	num
title	Specification for Multilayer Hybrid Circuits	en
type	standard
page	35
status	Active
tree	IPC - Association Connecting Electronics Industries:;1987
contenttype	fulltext