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IPC TR-466
Wetting Balance Standard Weight Comparison Test
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: INTRODUCTION
The wetting balance test method was the subject of much discussion during the preparation of ANSI/J-STD-O02, Solderability Tests for Components Leads, Terminations, Lugs, Terminals and Wires. Since no clear consensus was reached regarding the accept/reject criteria for the wetting balance test, the procedure was placed in a section of the standard reserved for tests without requirements. A Wetting Balance Task Group was chartered to refine the test procedure and derive acceptance test requirements.
The Wetting Balance Task Group established a four step strategy:
1. Study wetting balance weight measurement precision to establish correlation among all test users, and equipment manufacturers.
2. Develop standard test samples.
3. Study effects of surface finish and preparation, component geometry and thermal effects of fixtures.
4. Recommend a revised test procedure with acceptance test requirements.
This technical report discusses the results of the Task Group efforts to date on Step 1 of the strategy; establishing correlation among wetting balance test users.
The wetting balance test method was the subject of much discussion during the preparation of ANSI/J-STD-O02, Solderability Tests for Components Leads, Terminations, Lugs, Terminals and Wires. Since no clear consensus was reached regarding the accept/reject criteria for the wetting balance test, the procedure was placed in a section of the standard reserved for tests without requirements. A Wetting Balance Task Group was chartered to refine the test procedure and derive acceptance test requirements.
The Wetting Balance Task Group established a four step strategy:
1. Study wetting balance weight measurement precision to establish correlation among all test users, and equipment manufacturers.
2. Develop standard test samples.
3. Study effects of surface finish and preparation, component geometry and thermal effects of fixtures.
4. Recommend a revised test procedure with acceptance test requirements.
This technical report discusses the results of the Task Group efforts to date on Step 1 of the strategy; establishing correlation among wetting balance test users.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:08:34Z | |
| date available | 2017-09-04T15:08:34Z | |
| date copyright | 04/01/1995 | |
| date issued | 1995 | |
| identifier other | LLHVCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/6454 | |
| description abstract | INTRODUCTION The wetting balance test method was the subject of much discussion during the preparation of ANSI/J-STD-O02, Solderability Tests for Components Leads, Terminations, Lugs, Terminals and Wires. Since no clear consensus was reached regarding the accept/reject criteria for the wetting balance test, the procedure was placed in a section of the standard reserved for tests without requirements. A Wetting Balance Task Group was chartered to refine the test procedure and derive acceptance test requirements. The Wetting Balance Task Group established a four step strategy: 1. Study wetting balance weight measurement precision to establish correlation among all test users, and equipment manufacturers. 2. Develop standard test samples. 3. Study effects of surface finish and preparation, component geometry and thermal effects of fixtures. 4. Recommend a revised test procedure with acceptance test requirements. This technical report discusses the results of the Task Group efforts to date on Step 1 of the strategy; establishing correlation among wetting balance test users. | |
| language | English | |
| title | IPC TR-466 | num |
| title | Wetting Balance Standard Weight Comparison Test | en |
| type | standard | |
| page | 16 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |