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Wetting Balance Standard Weight Comparison Test

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:08:34Z
date available2017-09-04T15:08:34Z
date copyright04/01/1995
date issued1995
identifier otherLLHVCAAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/6454
description abstractINTRODUCTION
The wetting balance test method was the subject of much discussion during the preparation of ANSI/J-STD-O02, Solderability Tests for Components Leads, Terminations, Lugs, Terminals and Wires. Since no clear consensus was reached regarding the accept/reject criteria for the wetting balance test, the procedure was placed in a section of the standard reserved for tests without requirements. A Wetting Balance Task Group was chartered to refine the test procedure and derive acceptance test requirements.
The Wetting Balance Task Group established a four step strategy:
1. Study wetting balance weight measurement precision to establish correlation among all test users, and equipment manufacturers.
2. Develop standard test samples.
3. Study effects of surface finish and preparation, component geometry and thermal effects of fixtures.
4. Recommend a revised test procedure with acceptance test requirements.
This technical report discusses the results of the Task Group efforts to date on Step 1 of the strategy; establishing correlation among wetting balance test users.
languageEnglish
titleIPC TR-466num
titleWetting Balance Standard Weight Comparison Testen
typestandard
page16
statusActive
treeIPC - Association Connecting Electronics Industries:;1995
contenttypefulltext


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