• 0
    • ارسال درخواست
    • حذف همه
    • Industrial Standards
    • Defence Standards
  • درباره ما
  • درخواست موردی
  • فهرست استانداردها
    • Industrial Standards
    • Defence Standards
  • راهنما
  • Login
  • لیست خرید شما 0
    • ارسال درخواست
    • حذف همه
View Item 
  •   YSE
  • Industrial Standards
  • IPC - Association Connecting Electronics Industries
  • View Item
  •   YSE
  • Industrial Standards
  • IPC - Association Connecting Electronics Industries
  • View Item
  • All Fields
  • Title(or Doc Num)
  • Organization
  • Year
  • Subject
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Archive

IPC TM-650 2.3.23.1A

Cure (Permanency) UV Initiated Dry Film Solder Masks

Organization:
IPC - Association Connecting Electronics Industries
Year: 1988

Abstract: This test method covers the cure, or permanence testing of ultraviolet-initiated dry film solder mask (solder resist) organic coatings. Dry film solder masking is the application of a film coating on laminates and circuits. Following processing and curing, the dry film mask covers only those areas where no solder is to appear and, conversely, does not cover those areas where soldering is intended.
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/16272
Collections :
  • IPC - Association Connecting Electronics Industries
  • Download PDF : (18.94Kb)
  • Show Full MetaData Hide Full MetaData
  • Statistics

    IPC TM-650 2.3.23.1A

Show full item record

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:16:56Z
date available2017-09-04T15:16:56Z
date copyright02/01/1988
date issued1988
identifier otherMLFECAAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/16272
description abstractThis test method covers the cure, or permanence testing of ultraviolet-initiated dry film solder mask (solder resist) organic coatings. Dry film solder masking is the application of a film coating on laminates and circuits. Following processing and curing, the dry film mask covers only those areas where no solder is to appear and, conversely, does not cover those areas where soldering is intended.
languageEnglish
titleIPC TM-650 2.3.23.1Anum
titleCure (Permanency) UV Initiated Dry Film Solder Masksen
typestandard
page2
statusActive
treeIPC - Association Connecting Electronics Industries:;1988
contenttypefulltext
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian
 
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian