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IPC TM-650 2.4.30
Impact Resistance, Polymer Film
Organization:
IPC - Association Connecting Electronics Industries
Year: 1986
Abstract: This test method is to determine the impact resistance of polymer film circuitry when exposed to a series of falling ball impingements. The method is used to evaluate the resistance to chipping, flaking, convolution or other forms of separation of the polymer film from either the conductor or base laminate material surfaces.
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IPC TM-650 2.4.30
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:19:06Z | |
| date available | 2017-09-04T15:19:06Z | |
| date copyright | 31686 | |
| date issued | 1986 | |
| identifier other | MSHWCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/18853 | |
| description abstract | This test method is to determine the impact resistance of polymer film circuitry when exposed to a series of falling ball impingements. The method is used to evaluate the resistance to chipping, flaking, convolution or other forms of separation of the polymer film from either the conductor or base laminate material surfaces. | |
| language | English | |
| title | IPC TM-650 2.4.30 | num |
| title | Impact Resistance, Polymer Film | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1986 | |
| contenttype | fulltext |