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IPC TM-650 2.6.16.1
Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)
Organization:
IPC - Association Connecting Electronics Industries
Year: 1998
Abstract: This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated constructions, the results may be affected by the process conditions.
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IPC TM-650 2.6.16.1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:27:56Z | |
| date available | 2017-09-04T15:27:56Z | |
| date copyright | 08/01/1998 | |
| date issued | 1998 | |
| identifier other | NSWXHAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/28928 | |
| description abstract | This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated constructions, the results may be affected by the process conditions. | |
| language | English | |
| title | IPC TM-650 2.6.16.1 | num |
| title | Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel) | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |