IPC TM-650 2.6.16.1

Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:27:56Z
date available	2017-09-04T15:27:56Z
date copyright	08/01/1998
date issued	1998
identifier other	NSWXHAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/28928
description abstract	This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated constructions, the results may be affected by the process conditions.
language	English
title	IPC TM-650 2.6.16.1	num
title	Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)	en
type	standard
page	2
status	Active
tree	IPC - Association Connecting Electronics Industries:;1998
contenttype	fulltext