درباره ما
IPC SPVC-LAT1
ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA
Organization:
IPC - Association Connecting Electronics Industries
Year: 2010
Abstract: This document prescribes general requirements for determining critical physical and mechanical properties of bulk lead-free solder alloys used to make high quality electronic interconnections. This document describes material tests that generate portable data for: (1) direct comparison of different alloys, (2) aiding in alloy acceptability determination for various applications, (3) development of reliability models, and (4) other uses.
Purpose This standard defines the characteristics of solder alloys through the definitions of properties and specification of test methods. These requirements for solder alloys are defined in general terms of material properties. In practice, where more stringent requirements are necessary, additional requirements shall be defined by mutual agreement between the user and supplier. Users are cautioned to perform other tests (beyond the scope of this specification) to fully determine the acceptability of solder alloys for specific purposes.
Purpose This standard defines the characteristics of solder alloys through the definitions of properties and specification of test methods. These requirements for solder alloys are defined in general terms of material properties. In practice, where more stringent requirements are necessary, additional requirements shall be defined by mutual agreement between the user and supplier. Users are cautioned to perform other tests (beyond the scope of this specification) to fully determine the acceptability of solder alloys for specific purposes.
Collections
:
Show full item record
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:39:42Z | |
| date available | 2017-09-04T15:39:42Z | |
| date copyright | 05/01/2010 | |
| date issued | 2010 | |
| identifier other | PBVZRCAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/41906 | |
| description abstract | This document prescribes general requirements for determining critical physical and mechanical properties of bulk lead-free solder alloys used to make high quality electronic interconnections. This document describes material tests that generate portable data for: (1) direct comparison of different alloys, (2) aiding in alloy acceptability determination for various applications, (3) development of reliability models, and (4) other uses. Purpose This standard defines the characteristics of solder alloys through the definitions of properties and specification of test methods. These requirements for solder alloys are defined in general terms of material properties. In practice, where more stringent requirements are necessary, additional requirements shall be defined by mutual agreement between the user and supplier. Users are cautioned to perform other tests (beyond the scope of this specification) to fully determine the acceptability of solder alloys for specific purposes. | |
| language | English | |
| title | IPC SPVC-LAT1 | num |
| title | ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA | en |
| type | standard | |
| page | 10 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2010 | |
| contenttype | fulltext |