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IPC TM-650 2.4.24C
Glass Transition Temperature and Z-Axis Thermal Expansion by TMA
Organization:
IPC - Association Connecting Electronics Industries
Year: 1994
Abstract: This test is designed to determine the Glass Transition Temperature (Tg) and the Thermal Expansion in the Z-Axis of dielectric materials used in printed boards by the use of thermal mechanical analysis (TMA).
Thermal Expansion (TE) is expressed in Coefficient of Thermal Expansion (CTE) or Percent of Thermal Expansion (PTE).
Thermal Expansion (TE) is expressed in Coefficient of Thermal Expansion (CTE) or Percent of Thermal Expansion (PTE).
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IPC TM-650 2.4.24C
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:42:00Z | |
| date available | 2017-09-04T15:42:00Z | |
| date copyright | 34669 | |
| date issued | 1994 | |
| identifier other | PIKYCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/44338 | |
| description abstract | This test is designed to determine the Glass Transition Temperature (Tg) and the Thermal Expansion in the Z-Axis of dielectric materials used in printed boards by the use of thermal mechanical analysis (TMA). Thermal Expansion (TE) is expressed in Coefficient of Thermal Expansion (CTE) or Percent of Thermal Expansion (PTE). | |
| language | English | |
| title | IPC TM-650 2.4.24C | num |
| title | Glass Transition Temperature and Z-Axis Thermal Expansion by TMA | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1994 | |
| contenttype | fulltext |